Mechanical Engineering

Download PDF by E-H Wong,Y. -W. Mai: Robust Design of Microelectronics Assemblies Against

By E-H Wong,Y. -W. Mai

ISBN-10: 1845695283

ISBN-13: 9781845695286

Robust layout of Microelectronics Assemblies opposed to Mechanical surprise, Temperature and Moisture discusses how the reliability of packaging elements is a first-rate drawback to electronics brands.

The textual content provides an intensive overview of this crucial box of study, delivering clients with a realistic consultant that discusses theoretical features, experimental effects, and modeling recommendations.

The authors use their wide event to provide certain chapters masking temperature, moisture, and mechanical surprise precipitated failure, adhesive interconnects, and viscoelasticity. worthwhile software documents and macros also are included.

  • Discusses how the reliability of packaging elements is a major crisis to electronics manufacturers
  • Presents an intensive evaluation of this crucial box of analysis, supplying clients with a pragmatic consultant that discusses theoretical features, experimental effects, and modeling techniques
  • Includes application documents and macros for extra study

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Read Online or Download Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and Electrical ... Series in Electronic and Optical Materials) PDF

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and Electrical ... Series in Electronic and Optical Materials) by E-H Wong,Y. -W. Mai


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